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february 2007 rev 3 1/15 15 low on-voltage drop (v cesat ) low c res / c ies ratio (no cross-conduction susceptibility) very soft ultra fast recovery antiparallel diode description using the latest high voltage technology based on a patented strip layout, stmicroelectronics has designed an advanced family of igbts, the powermesh ? igbts, with outstanding performances. the suffix ?h? identifies a family optimized for high frequency applications in order to achieve very high switching performances (reduced tfall) manta in ing a low voltage drop. applications high frequency motor controls smps and pfc in both hard switch and resonant topologies motor drivers internal schematic diagram general features type v ces v ce(sat) (max)@ 25c i c @100c STGB10NC60HD 600v < 2.5v 10a stgp10nc60hd 600v < 2.5v 10a 1 3 1 2 3 d2pak to-220 STGB10NC60HD stgp10nc60hd n-channel 600v - 10a - to-220 - d 2 pa k very fast powermesh? igbt www.st.com order codes part number marking package packaging STGB10NC60HD gb10nc60hd d2pak tape & reel stgp10nc60hd gp10nc60hd to-220 tube
electrical ratings STGB10NC60HD - stgp10nc60hd 2/15 1 electrical ratings table 1. absolute maximum ratings symbol parameter value unit v ces collector-emitter voltage (v gs = 0) 600 v i c (1) 1. calculated according to the iterative formula:: collector current (continuous) at t c = 25c 20 a i c (1) collector current (continuous) at t c = 100c 10 a i cl (2) 2. v clamp =480v, tj=150c, r g =10 ? , v ge =15v collector current (pulsed) 40 a i f diode rms forward current at t c = 25c 10 a v ge gate-emitter voltage 20 v p tot total dissipation at t c = 25c 60 w t stg storage temperature ? 55 to 150 c t j operating junction temperature table 2. thermal resistance symbol parameter value unit rthj-case thermal resistance junction-case max 2.08 c/w rthj-amb thermal resistance junction-ambient max 62.5 c/w i c t c () t jmax t c ? r thj c ? v cesat max () t c i c , () ------------------------------------------------------------------------------------------------------ =
STGB10NC60HD - stgp10nc60hd electrical characteristics 3/15 2 electrical characteristics (t case =25c unless otherwise specified) table 3. static symbol parameter test conditions min. typ. max. unit v br(ces) collector-emitter breakdown voltage i c = 1ma, v ge = 0 600 v v ce(sat) collector-emitter saturation voltage v ge = 15v, i c = 5a v ge = 15v, i c = 5a, tc= 125c 1.9 1.7 2.5 v v v ge(th) gate threshold voltage v ce = v ge , i c = 250 a 3.75 5.75 v i ces collector cut-off current (v ge = 0) v ce = max rating,t c = 25c v ce =max rating,t c = 125c 150 1 a ma i ges gate-emitter leakage current (v ce = 0) v ge = 20v, v ce = 0 100 na g fs forward transconductance v ce = 15v , i c = 5a 3.5 s table 4. dynamic symbol parameter test cond itions min. typ. max. unit c ies c oes c res input capacitance output capacitance reverse transfer capacitance v ce = 25v, f = 1mhz, v ge = 0 365 43 8.3 pf pf pf q g q ge q gc total gate charge gate-emitter charge gate-collector charge v ce = 390v, i c = 5a, v ge = 15v, (see figure 17) 19.2 4.5 7 nc nc nc
electrical characteristics STGB10NC60HD - stgp10nc60hd 4/15 table 5. switching on/off (inductive load) symbol parameter test conditions min. typ. max. unit t d(on) t r (di/dt) on turn-on delay time current rise time turn-on current slope v cc = 390v, i c = 5a r g = 10 ? , v ge = 15v, tj= 25c (see figure 16) 14.2 5 1000 ns ns a/s t d(on) t r (di/dt) on turn-on delay time current rise time turn-on current slope v cc = 390v, i c = 5a r g = 10 ? , v ge = 15v, tj=125c (see figure 16) 14 5 920 ns ns a/s t r (v off ) t d ( off ) t f off voltage rise time turn-off delay time current fall time v cc = 390v, i c = 5a, r ge = 10 ? , v ge = 15v,t j =25c (see figure 16) 27 72 85 ns ns ns t r (v off ) t d ( off ) t f off voltage rise time turn-off delay time current fall time v cc = 390v, i c = 5a, r ge =10 ? , v ge =15v, tj=125c (see figure 16) 50 108 139 ns ns ns table 6. switching energy (inductive load) symbol parameter test conditions min. typ. max. unit e on (1) e off (2) e ts 1. eon is the tun-on losses when a typical diode is used in the test circuit in figure 2. if the igbt is offered in a package with a co-pak diode, the co-pack diode is used as external diode. igbts & diode are at the same temperature (25c and 125c) 2. turn-off losses include also the tail of the collector current turn-on switching losses turn-off switching losses total switching losses v cc = 390v, i c = 5a r g =10 ? , v ge =15v, tj=25c (see figure 16) 31.8 95 126.8 j j j e on (1) e off (2) e ts turn-on switching losses turn-off switching losses total switching losses v cc = 390v, i c = 5a r g =10 ? , v ge = 15v, tj= 125c (see figure 16) 61.8 173 234.8 j j j
STGB10NC60HD - stgp10nc60hd electrical characteristics 5/15 table 7. collector-emitter diode symbol parameter test cond itions min. typ. max. unit v f forward on-voltage i f = 2.5a i f = 2.5a, tj = 125c 1.75 1.3 2.1 v v t rr q rr i rrm reverse recovery time reverse recovery charge reverse recovery current i f = 5a,v r = 40v, tj = 25c, di/dt = 100 a/ s (see figure 19) 21.5 14.2 1.32 ns nc a t rr q rr i rrm reverse recovery time reverse recovery charge reverse recovery current i f = 5a,v r = 40v, tj =125c, di/dt = 100a/ s (see figure 19) 33 30.5 1.85 ns nc a
electrical characteristics STGB10NC60HD - stgp10nc60hd 6/15 2.1 electrical characteri stics (curves) figure 1. output characteristics figure 2. transfer characteristics figure 3. transconductance figure 4. collector-emitter on voltage vs temperature figure 5. gate charge vs gate-source voltage figure 6. capacitance variations
STGB10NC60HD - stgp10nc60hd electrical characteristics 7/15 figure 7. normalized gate threshold voltage vs temperature figure 8. collector-emitter on voltage vs collector current figure 9. normalized breakdown voltage vs temperature figure 10. switching losses vs temperature figure 11. switching losses vs gate resistance figure 12. switching losses vs collector current
electrical characteristics STGB10NC60HD - stgp10nc60hd 8/15 figure 13. thermal impedance figure 14. turn-off soa figure 15. emitter-collector diode characteristics
STGB10NC60HD - stgp10nc60hd test circuit 9/15 3 test circuit figure 16. test circuit for inductive load switching figure 17. gate charge test circuit figure 18. switching waveform figure 19. diode recovery time waveform
package mechanical data STGB10NC60HD - stgp10nc60hd 10/15 4 package mechanical data in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com
STGB10NC60HD - stgp10nc60hd package mechanical data 11/15 dim. mm. inch min. typ max. min. typ. max. a 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034 b1 1.15 1.70 0.045 0.066 c 0.49 0.70 0.019 0.027 d 15.25 15.75 0.60 0.620 e 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.194 0.202 f 1.23 1.32 0.048 0.052 h1 6.20 6.60 0.244 0.256 j1 2.40 2.72 0.094 0.107 l 13 14 0.511 0.551 l1 3.50 3.93 0.137 0.154 l20 16.40 0.645 l30 28.90 1.137 ?p 3.75 3.85 0.147 0.151 q 2.65 2.95 0.104 0.116 to-220 mechanical data
package mechanical data STGB10NC60HD - stgp10nc60hd 12/15 to-247 mechanical data 1 dim. mm. inch min. typ max. min. typ. max. a 4.4 4.6 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.7 0.93 0.027 0.036 b2 1.14 1.7 0.044 0.067 c 0.45 0.6 0.017 0.023 c2 1.23 1.36 0.048 0.053 d 8.95 9.35 0.352 0.368 d1 8 0.315 e 10 10.4 0.393 e1 8.5 0.334 g 4.88 5.28 0.192 0.208 l 15 15.85 0.590 0.625 l2 1.27 1.4 0.050 0.055 l3 1.4 1.75 0.055 0.068 m 2.4 3.2 0.094 0.126 r0.4 0.015 v2 0o 4o d 2 pak mechanical data 3
STGB10NC60HD - stgp10nc60hd packaging mechanical data 13/15 5 packaging mechanical data tape and reel shipment d 2 pak footprint * on sales type dim. mm inch min. max. min. max. a 330 12.992 b 1.5 0.059 c 12.8 13.2 0.504 0.520 d 20.2 0795 g 24.4 26.4 0.960 1.039 n 100 3.937 t 30.4 1.197 base qty bulk qty 1000 1000 reel mechanical data dim. mm inch min. max. min. max. a0 10.5 10.7 0.413 0.421 b0 15.7 15.9 0.618 0.626 d 1.5 1.6 0.059 0.063 d1 1.59 1.61 0.062 0.063 e 1.65 1.85 0.065 0.073 f 11.4 11.6 0.449 0.456 k0 4.8 5.0 0.189 0.197 p0 3.9 4.1 0.153 0.161 p1 11.9 12.1 0.468 0.476 p2 1.9 2.1 0.075 0.082 r 50 1.574 t 0.25 0.35 0.0098 0.0137 w 23.7 24.3 0.933 0.956 tape mechanical data
revision history stgb 10nc60hd - stgp10nc60hd 14/15 6 revision history table 8. revision history date revision changes 30-jan-2006 1 initial release. 06-nov-2006 2 complete version 08-feb-2007 3 the document has been reformatted
STGB10NC60HD - stgp10nc60hd 15/15 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2007 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com

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